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Associate Professor, Key Lab of MEMS of Ministry of Education
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Biography: |
本科、硕士毕业于哈尔滨工业大学，博士毕业于英国格林威治大学。在微电子器件和系统可靠性分析与预测领域有丰富的科研和教学经验，尤其是在高可靠应用领域（如飞机，雷达）的电子器件的可靠性分析方面有较多的实践经验。擅长使用有限元分析，优化计算，统计学分析等数学方法解决工业界面临的实际问题。研究领域广泛，涉及航空航天，能源等重大领域，以第一作者及合作作者在该领域发表文章40余篇。在教学方面，具有丰富的英语教授本科和研究生经验。
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| Research interests: |
- 1. 高可靠性应用领域电子封装材料、方法及可靠性；
2. 基于失效物理的可靠性分析及建模；
3. 电子系统故障预测和健康管理。
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| Selected Publications: |
Parts of her papers:
1.C.Y. Yin, S. Stoyanov, C. Bailey and P. Stewart, “Thermomechanical Analysis of Conformally Coated QFNs for High-Reliability Applications”, IEEE Transactions on Components, Packaging and Manufacturing, 2019, 9(11): 2210-2218
2.F. Dinmohammadi, D. Flynn, C. Bailey, M. Pecht, C.Y. Yin, P. Rajaguru and V. Robu, “Predicting Damage and Life Expectancy of Subsea Power Cables in offshore Renewable Energy Applications”, IEEE Access, Vol.7, 2019，pp. 54658-54669
3.K. C. Nwanoro, H. Lu, C.Y. Yin and C. Bailey, “An Analysis of the Reliability and Design Optimization of Aluminum Ribbon Bonds in Power Electronics Modulus using Computer Simulation Method”, Microelectronics Reliability, Vol.87, Issue 2, 2018, pp. 1-14
4.C.Y. Yin, C. Best, C. Bailey and S. Stoyanov, “Statistical Analysis of the Impact of Refinishing Process on Leaded Components”, Microelectronics Reliability, 2015, 55: 424-431
5.M. Musallam, C.Y. Yin, C. Bailey and C.M. Johnson, “Mission Profile-Based Reliability Design and Real-Time Life Consumption Estimation in Power Electronics”, IEEE Transactions on Power Electronics, 2015, 30(5): 2601-2613
6.M. Musallam, C.Y. Yin, C. Bailey, C.M. Johnson, “Application of Coupled Electro-thermal and Physics-of-failure-based Analysis to the Design of Accelerated Life Tests for Power Modules”, Microelectronics Reliability, 2014, 54: 172-181
7.C.Y. Yin, H. Lu, M. Musallam, C. Bailey and C.M. Johnson, “Prognostic Reliability Analysis of Power Electronics Modules” International Journal of Performability Engineering, 2010, 6: 513-524
8.H. Lu, C. Bailey, C.Y. Yin, “Design for Reliability of Power Electronics Modules”，Microelectronics Reliability, 2009, 49: 1250-1255
9.C.Y. Yin, H. Lu, C. Bailey and Y.C. Chan, “Macro-Micro Modelling Analysis for an ACF Flip Chip”, Soldering & Surface Mount Technology, 2006, 18(2): 27-32
10.C.Y. Yin, H. Lu, C. Bailey and Y.C. Chan, “The Effect of Reflow Process on the Contact Resistance and Reliability of Anisotropic Conductive Film Interconnection for Flip Chip on Flex Applications”, Microelectronics Reliability, 2003, 43: 625-633
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